Glass bonding process
Overview
This is a processing technology that directly joins glass materials together. It enables joining while maintaining high heat resistance, chemical resistance, and optical properties.
Features
Because it does not use adhesives, it exhibits stable performance even in high-temperature environments and under chemical loads such as chemicals. Furthermore, it has excellent optical transparency, making it a suitable bonding technology for optical applications and precision device applications.
Blind cavity processing
By joining an open cavity (glass with through-holes) to a sheet of glass, a cavity structure with a bottom surface can be formed. This makes it possible to create high-precision blind cavities with vertical side walls.
Glass chip tray
These glass trays for transporting chips are manufactured with high precision using microfabrication and joining technologies, taking advantage of the heat resistance, chemical resistance, and dimensional stability of glass.
Glass microfluidic
By sealing microchannels formed on a glass substrate using bonding technology, high-precision microchannels can be fabricated. Because bonding does not use adhesives, contamination within the channels is minimized, making it suitable for fields requiring high reliability, such as chemical analysis and bio-applications.
Glass suction stage
Leveraging its heat resistance and high dimensional stability, it can reliably adsorb and fix minute components.
Specification
Processing size
～300×300mm
Processing plate thickness
0.3mm/piece
Compatible glass types
Alkali-free glass / Quartz glass
Compatible shapes
Panel shape, wafer shape, and other shapes are also negotiable.
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