At ‘SEMICON JAPAN 2025’, which was held from 17th (Wed) to 19th (Fri), 2025.
Thank you very much for visiting our booth despite your heavy use.

At this exhibition

●Exhibition focusing on four issues and solutions for commercializing glass substrates

　・TGV board with pore diameter, pore shape, and one hole

　・TGV board with an aspect ratio of 20:1

　・Bore-filled substrate using sintered metal

　・About the cleanliness

●Introduction of technology using AG sintered metal

●Introduction of precision glass processing technology

　・Amazing aspect ratio board (200:1)

　・TGV processing on quartz glass

　・Glass cavities

　・Fine copper-plated wiring board

has been exhibited.

In addition, the materials distributed at the exhibition areDownload from hereYou can have it.

If you have any questions or concerns regarding the products we have introduced,

Our person in charge orContact formWe would appreciate it if you could contact us more.

We look forward to your continued support in the future.