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Semiconductor Glass Core
TGV processing
This is a technology for forming minute bonding holes in glass substrates.
It is compatible with various glass materials.
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Glass Etching
This technology uses chemicals to dissolve the glass surface and thin the glass to any desired thickness. It is also possible to form wiring patterns and uneven shapes.
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Sputtering processing
This is a technology for coating the surface of a substrate with a thin metal film. It involves scattering material atoms in a vacuum chamber and depositing them onto the substrate.
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Thin film metal etching
In addition to common metal materials such as Au, Ag, and Cu, we can also perform etching on a variety of other metals.
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Photofabrication
This technology forms fine patterns using photosensitive material through exposure and development. It can be used for semiconductors, electronic components, and fine metal parts.
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