TGV processing
Overview
This is a technology for forming minute bonding holes in glass substrates.
It is compatible with various glass materials.
Features
Excellent uniformity of hole diameter.
Achieves aspect ratios up to 150:1.
Pore size uniformity
Large glass is machined with holes of uniform diameter.
Aspect Ratio
A ratio of up to 150:1 has been achieved.
High verticality
We process with a verticality of 90% or more.
Supports various board sizes
TGV processing is possible up to a maximum size of 510 x 515.
Specification
Processing size
～510mm×515mm
Plate thickness
0.4mm～1.8mm
Hole Diameter
Φ20μm～
Through-hole shape
Straight, Hourglass
Glass Type
Alkaline-free glass, alkali glass, quartz glass, heat-resistant glass
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