Sputtering processing

Overview

This is a technology for coating the surface of a substrate with a thin metal film. It involves scattering material atoms in a vacuum chamber and depositing them onto the substrate.

Features

High adhesion

Film uniformity

Thickness can be adjusted

Compatible with various substrates such as glass, silicon wafers, and ceramics

Specification

Processing size

100×100mm～550×650mm

Film type

Cu/Cr/Au/Al/ITO/Ti
Ni/Mo/W/AlNd/MoNd
NiCr/APC/NiV

Field

In Vehicle Semiconductor Mobile Biomedical MEMS FA

Appolocation

High Frequency Device Electronic Devices Automotive Components Display Device Semiconductor Glass Core Medical Devices Mobile Componets MEMS

Return to list