Photofabrication

Overview

This technology forms fine patterns using photosensitive material through exposure and development. It can be used for semiconductors, electronic components, and fine metal parts.

Features

Mask exposure
Maskless exposure machine
No masks are required, so prototypes can be produced in a short time.
Compatible with a variety of substrate materials

Specification

Processing size
Mask exposure: 320 x 320 mm
Maskless exposure: 300 x 400 mm
Exposure wavelength
Mask exposure: Broad wavelength maskless exposure: 375 nm
L/S
3μm/3μm~

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