Glass Etching

Overview

This technology uses chemicals to dissolve the glass surface and thin the glass to any desired thickness. It is also possible to form wiring patterns and uneven shapes.

Features

Highly accurate thickness adjustment possible

It is possible to thin the surface uniformly

Specification

Processing size

～510×515

Processed plate thickness

0.05mm～2mm

Field

In Vehicle Semiconductor Mobile Biomedical MEMS FA

Appolocation

High Frequency Device Electronic Devices Semiconductor Glass Core MEMS

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