At the ‘Nepcon Japan Microfabrication EXPO’ held from January 21 (Wed) to 23 (Fri), 2026,
Thank you very much for visiting our booth despite your heavy use.

At this exhibition

– New ideas to replace ceramic base materials! Introduction of Glass x Ag Sintered Metal
　・Fine wiring
　・TGV board with an aspect ratio of 20:1
　・High adhesion
　- Soldering properties

Introduction of innovative plating technology
　・High-adhesion plated plated with any material
　・High-definition circuit board

●Introduction of the glass adsorption stage

●Introduction of glass chip trays

Introduction of high precision glass processing technology
　・TGV board with pore diameter, pore shape, and one hole
　・Glass cavities

has been exhibited.
In addition, the materials distributed at the exhibition areDownload from hereYou can have it.

If you have any questions or concerns regarding the products we have introduced,
Our person in charge orContact formWe would appreciate it if you could contact us more.

We look forward to your continued support in the future.