MICRO's Challenges
Toward Achieving Glass Substrates for Next-generation Semiconductors
As a component of next-generation semiconductor packages, Micro Technology is engaged in R&D for commercializing glass substrates as an alternative to conventional ceramic or resin substrates.
While major semiconductor manufacturers have been advancing development of glass substrates for some time, they are yet to be put into practical use. This is due to the issues involved in addressing technical challenges such as TGV processing precision and the difficulty of via-filling processing.
We are now taking on this difficult mission as a challenge, leveraging the technical capabilities we have cultivated to date.
Glass x Sintered Metal—a New Concept
We have developed a technology that uses sintered metal as a conductive material for wiring processing on glass, in order to achieve semiconductor packages using glass substrates.
Fine wiring processing on glass materials using sintered metal is unprecedented and represents a completely new endeavor.
In addition to wiring processing, we are also engaged in research and development aimed at using sintered metal for hole filling processing.
Going forward, we will take on the challenge of applications for more concrete specifications and subsequent practical implementation, based on the needs of our customers.
A Vision of the Future Achieved with MICRO’s Technology
Generative AI and autonomous driving systems that are becoming popular around the world require fast, high-volume processing of data.
On the other hand, with the increase in data being processed at data centers, the associated power consumption will become immense. As a result, CO2 emissions will also increase, raising concerns that this will accelerate global warming.
The practical implementation of semiconductor packages using glass substrates that MICRO is working on may help address this global societal challenge.
Glass substrates with a flat surface enable further miniaturization and higher wiring density, and allow signals to be transmitted faster and more accurately than before. In other words, more data can be transmitted with less power, reducing the impact on environmental accordingly.
That is the future that we envision.
